Release film for semiconductor package molds and plastic injection molds.
High hardness thin film capable of forming at low temperatures. Low surface energy, low adhesion.
MiCC is a CrN film coated using the FCVA method. It is suitable as a release film for semiconductor package molds and injection molding molds. Since the coating is performed at low temperatures, there is no deformation or alteration of the substrate material. In addition to the metal film (MiCC), it is also possible to coat hydrogen-free DLC (TAC) films. 【Features of MiCC】 ■ Low surface energy (improved release properties) ■ Low-temperature synthesis (>150℃) ■ High hardness (~20GPa) ■ Excellent adhesion (critical load >80N @ 200um tip) ■ Low friction coefficient 【Application Fields】 ■ Semiconductor encapsulation package molds ■ Injection molding molds ■ Rubber molding molds For more details, please refer to our website.
- Company：株式会社ナノフィルムテクノロジーズ ジャパン
- Price：Other
